The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 2016

Filed:

Aug. 30, 2013
Applicant:

Samhwa Capacitor Co., Ltd., Yongin-si, KR;

Inventors:

Young Joo Oh, Seoul, KR;

Jung Rag Yoon, Yongin-si, KR;

Kyung Min Lee, Paju-si, KR;

Young Min Yoo, Suwon-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/38 (2006.01); H01G 4/40 (2006.01); H01G 2/06 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/30 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H01G 4/38 (2013.01); H01G 2/06 (2013.01); H01G 4/40 (2013.01); H05K 1/0231 (2013.01); H05K 1/116 (2013.01); H05K 3/306 (2013.01); H05K 3/4641 (2013.01); H05K 2201/09309 (2013.01); H05K 2201/09345 (2013.01); H05K 2201/09718 (2013.01); H05K 2201/1034 (2013.01); Y02T 10/7022 (2013.01);
Abstract

A direct current (DC) link capacitor module includes a printed circuit board (PCB) formed by sequentially disposing a first electrode substrate, an insulation substrate, a second electrode substrate, a third electrode substrate; a plurality of DC link capacitors connected in parallel to each of the first electrode substrate and the second electrode substrate; a plurality of first Y-capacitors connected in series to each of the first electrode substrate and the third electrode substrate, and connected in parallel to the DC link capacitors; and a plurality of second Y-capacitors connected in series to each of the first electrode substrate and the third electrode substrate, and connected in parallel to the first Y-capacitors, thereby achieving a miniaturization and facilitating a fabrication by connecting the plurality of DC link capacitors using the PCB.


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