The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 2016
Filed:
Oct. 14, 2011
Tomokazu Ito, Tokyo, JP;
Hitoshi Ohkubo, Tokyo, JP;
Yoshihiro Maeda, Tokyo, JP;
Makoto Morita, Tokyo, JP;
Toshiyuki Anbo, Tokyo, JP;
Kyohei Tonoyama, Tokyo, JP;
Manabu Ohta, Tokyo, JP;
Tomokazu Ito, Tokyo, JP;
Hitoshi Ohkubo, Tokyo, JP;
Yoshihiro Maeda, Tokyo, JP;
Makoto Morita, Tokyo, JP;
Toshiyuki Anbo, Tokyo, JP;
Kyohei Tonoyama, Tokyo, JP;
Manabu Ohta, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
A coil component includes: an insulating resin layer provided between a first planar spiral conductor formed on a back surface of a first substrate and a second planer spiral conductor formed on a back surface of a second substrate; an upper core covering a third second planer spiral conductor formed on a front surface of the first substrate on which the insulating resin layer is formed; and a lower core covering a fourth planer spiral conductor formed on a front surface of the second substrate on which the insulating resin layer is formed. One of the upper and lower cores is formed of a metal-magnetic-powder-containing resin. The coil component includes connecting portions disposed respectively at center and outside portions of each of the first and second substrates so as to physically connect the upper and lower cores.