The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 2016

Filed:

Nov. 29, 2011
Applicants:

Mitchell Stewart Burberry, Webster, NY (US);

Ronald Steven Cok, Rochester, NY (US);

Inventors:

Mitchell Stewart Burberry, Webster, NY (US);

Ronald Steven Cok, Rochester, NY (US);

Assignee:

EASTMAN KODAK COMPANY, Rochester, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/044 (2006.01); H01G 4/008 (2006.01); H01G 4/005 (2006.01); G02F 1/1343 (2006.01); H05K 3/02 (2006.01); H05K 1/16 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
G06F 3/044 (2013.01); H01G 4/005 (2013.01); H01G 4/008 (2013.01); G02F 1/13439 (2013.01); G06F 2203/04102 (2013.01); G06F 2203/04103 (2013.01); H05K 1/162 (2013.01); H05K 3/027 (2013.01); H05K 3/4626 (2013.01); H05K 3/4673 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1194 (2013.01);
Abstract

A transparent capacitor apparatus includes a first transparent substrate including a first patterned conductive layer having a first conductive material located over the first transparent substrate; a dielectric layer located over the first patterned conductive layer; a second patterned conductive layer including a second conductive material located over the dielectric layer, wherein the second pattern is different from the first pattern; and a second transparent substrate located over the second patterned conductive layer. Portions of the first conductive material of the first patterned conductive layer overlap portions of the second conductive material of the second patterned conductive layer. The overlapping portions of the first and second conductive materials form matching patterned electrical conductor(s) having spatially matching conducting and non-conductive areas, the non-conductive areas of the first and second patterned conductive layers having encapsulated coalesced conductive material structures.


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