The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 2016

Filed:

Aug. 20, 2012
Applicants:

Wen-hsiung Yang, New Taipei, TW;

Shih-huai Cho, New Taipei, TW;

Hua Chen, New Taipei, TW;

Inventors:

Wen-Hsiung Yang, New Taipei, TW;

Shih-Huai Cho, New Taipei, TW;

Hua Chen, New Taipei, TW;

Assignee:

Wistron Corporation, Hsichih, New Taipei, TW;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); G06F 1/20 (2006.01);
U.S. Cl.
CPC ...
G06F 1/20 (2013.01); H05K 7/20727 (2013.01); H05K 7/20145 (2013.01); H05K 7/20154 (2013.01); H05K 7/20181 (2013.01);
Abstract

A heat dissipating module having enhanced heat dissipating efficiency is disclosed. The heat dissipating module includes a heat dissipating member, a base and an air guiding member. The heat dissipating member is installed on a first electronic component for dissipating heat generated by the first electronic component. The base is installed on a side of the heat dissipating member, and the air guiding member is connected to the base. The air guiding member and the base cooperatively guide an air flow passing through the heat dissipating member to a second electronic component located on a side of the first electronic component.


Find Patent Forward Citations

Loading…