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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9235002 B1

PDFFull Text
Date of Patent:
Jan. 12, 2016

Filed:

Nov. 19, 2012

Integrated semiconductor device

Applicant:

Sumitomo Electric Industries, Ltd., Osaka-shi, Osaka, JP;

Inventor:

Tomokazu Katsuyama, Yokohama, JP;

Assignee:

SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka, JP;

Attorney:

Smith, Gambrell & Russell LLP.

Primary Examiner:

Ryan Lepisto

Assistant Examiner:

Mary El Shammaa

Int. Cl.
CPC ...
G02B 6/12 (2006.01); G02B 6/125 (2006.01); G02B 6/43 (2006.01); H01S 5/026 (2006.01); H01S 5/40 (2006.01); B82Y 20/00 (2011.01); H01S 5/22 (2006.01); H01S 5/343 (2006.01);
U.S. Cl.
CPC ...
G02B 6/125 (2013.01); B82Y 20/00 (2013.01); G02B 6/12 (2013.01); G02B 6/43 (2013.01); H01S 5/026 (2013.01); H01S 5/0265 (2013.01); H01S 5/4031 (2013.01); G02B 6/12004 (2013.01); G02B 2006/12097 (2013.01); H01S 5/22 (2013.01); H01S 5/34306 (2013.01);
Abstract

An integrated semiconductor device includes a substrate including a first portion, a second portion, and a third portion; a first waveguide provided on the first portion, the first waveguide including a base portion and a ridge portion provided on the base portion, the base portion containing a first core layer; a second waveguide provided on the second portion, the second waveguide including a first stripe-shaped mesa containing a second core layer; and a third waveguide provided on the third portion, the third waveguide including a second stripe-shaped mesa containing a third core layer. The first stripe-shaped mesa is connected to the base portion and the ridge portion. The first stripe-shaped mesa is connected to the second stripe-shaped mesa. The second core layer is formed integrally with the first core layer. The third core layer is joined to the second core layer by a butt-joint method.

Find Patent Forward Citations

Katsuyama, Tomokazu. (2016). Integrated semiconductor device (U.S. Patent No. 9235002). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9235002

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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