The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 2016

Filed:

Dec. 31, 2011
Applicants:

James Geza Deak, Zhangjiagang, CN;

Insik Jin, Zhangjiagang, CN;

Xiaofeng Lei, Zhangjiagang, CN;

Weifeng Shen, Zhangjiagang, CN;

Songsheng Xue, Zhangjiagang, CN;

Xiaojun Zhang, Zhangjiagang, CN;

Inventors:

James Geza Deak, Zhangjiagang, CN;

Insik Jin, Zhangjiagang, CN;

Xiaofeng Lei, Zhangjiagang, CN;

Weifeng Shen, Zhangjiagang, CN;

Songsheng Xue, Zhangjiagang, CN;

Xiaojun Zhang, Zhangjiagang, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 33/02 (2006.01); G01R 33/09 (2006.01);
U.S. Cl.
CPC ...
G01R 33/093 (2013.01); G01R 33/098 (2013.01);
Abstract

A magnetoresistive sensor bridge utilizing magnetic tunnel junctions is disclosed. The magnetoresistive sensor bridge is composed of one or more magnetic tunnel junction sensor chips to provide a half-bridge or full bridge sensor in a standard semiconductor package. The sensor chips may be arranged such that the pinned layers of the different chips are mutually anti-parallel to each other in order to form a push-pull bridge structure. The sensor chips are then interconnected using wire bonding. The chips can be wire-bonded to various standard semiconductor leadframes and packaged in inexpensive standard semiconductor packages. The bridge design may be push-pull or referenced. In the referenced case, the on-chip reference resistors may be implemented without magnetic shielding.


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