The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 2016

Filed:

Apr. 01, 2010
Applicants:

Hideya Yoshitake, Tokyo, JP;

Masayuki Nishio, Ube, JP;

Tsunao Matsuura, Ube, JP;

Kenji Fukuda, Ube, JP;

Ken Nakamura, Ube, JP;

Keiichirou Koyashiki, Ube, JP;

Masaki Yoshio, Saga, JP;

Hirofumi Takemoto, Ube, JP;

Inventors:

Hideya Yoshitake, Tokyo, JP;

Masayuki Nishio, Ube, JP;

Tsunao Matsuura, Ube, JP;

Kenji Fukuda, Ube, JP;

Ken Nakamura, Ube, JP;

Keiichirou Koyashiki, Ube, JP;

Masaki Yoshio, Saga, JP;

Hirofumi Takemoto, Ube, JP;

Assignee:

Ube Industries, Ltd., Ube-shi, Yamaguchi, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/04 (2006.01); H01B 1/24 (2006.01); B82Y 30/00 (2011.01); C08J 3/215 (2006.01); B01J 23/78 (2006.01); B01J 35/00 (2006.01); B01J 37/03 (2006.01); C08J 5/04 (2006.01); D01F 9/127 (2006.01); H01M 4/58 (2010.01); H01M 4/62 (2006.01); H01M 10/052 (2010.01);
U.S. Cl.
CPC ...
C08J 3/215 (2013.01); B01J 23/78 (2013.01); B01J 35/002 (2013.01); B01J 37/03 (2013.01); B82Y 30/00 (2013.01); C08J 5/042 (2013.01); D01F 9/127 (2013.01); H01M 4/5825 (2013.01); H01M 4/622 (2013.01); H01M 4/625 (2013.01); C08J 2327/18 (2013.01); H01M 10/052 (2013.01);
Abstract

There is disclosed a conductive resin composition, comprising: (a) a resin component, and (b) a fine carbon fiber dispersed in the resin component, wherein a graphite-net plane consisting solely of carbon atoms forms a temple-bell-shaped structural unit comprising closed head-top part and body-part with open lower-end, 2 to 30 of the temple-bell-shaped structural units are stacked sharing a common central axis to form an aggregate, and the aggregates are connected in head-to-tail style with a distance to form the fiber. The resin composition has high conductivity while maintaining the original physical properties of the resin.


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