The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 2016

Filed:

Jul. 27, 2011
Applicants:

Guenter Kratel, Durach, DE;

Gerd Borchert, Durach, DE;

Frank Menzel, Hanau, DE;

Inventors:

Guenter Kratel, Durach, DE;

Gerd Borchert, Durach, DE;

Frank Menzel, Hanau, DE;

Assignee:

Evonik Degussa GmbH, Essen, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C07F 7/02 (2006.01); C04B 30/02 (2006.01); C04B 41/00 (2006.01); C04B 41/49 (2006.01); C04B 41/64 (2006.01); C09C 1/30 (2006.01); C04B 111/28 (2006.01);
U.S. Cl.
CPC ...
C07F 7/025 (2013.01); C04B 30/02 (2013.01); C04B 41/009 (2013.01); C04B 41/4933 (2013.01); C04B 41/64 (2013.01); C09C 1/3081 (2013.01); C04B 2111/28 (2013.01); Y02W 30/94 (2015.05); Y02W 30/97 (2015.05); Y10T 29/4998 (2015.01);
Abstract

Process for hydrophobizing a microporous thermal insulation molding comprising hydrophilic silica, in which the molding is treated with at least one organosilane and in which one or more organosilanes which are gaseous under the reaction conditions are introduced into a chamber containing the microporous thermal insulation molding comprising hydrophilic silica until the pressure difference Δp is ≧20 mbar.


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