The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 2016

Filed:

Apr. 09, 2007
Applicants:

Bor Z. Jang, Centerville, OH (US);

Aruna Zhamu, Centerville, OH (US);

Jiusheng Guo, Centerville, OH (US);

Inventors:

Bor Z. Jang, Centerville, OH (US);

Aruna Zhamu, Centerville, OH (US);

Jiusheng Guo, Centerville, OH (US);

Assignee:

Nanotek Instruments, Inc., Dayton, OH (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/04 (2006.01); C01B 31/00 (2006.01); C01B 31/04 (2006.01); B82Y 30/00 (2011.01); B82Y 40/00 (2011.01); C04B 35/52 (2006.01);
U.S. Cl.
CPC ...
C01B 31/0423 (2013.01); B82Y 30/00 (2013.01); B82Y 40/00 (2013.01); C01B 31/043 (2013.01); C01B 31/0438 (2013.01); C01B 31/0469 (2013.01); C04B 35/521 (2013.01); C04B 35/522 (2013.01); H01B 1/04 (2013.01); C01B 31/0484 (2013.01); C01B 31/0492 (2013.01); C01B 2204/04 (2013.01); C01B 2204/22 (2013.01); C01B 2204/24 (2013.01);
Abstract

Disclosed is a nano-scaled graphene article comprising a non-woven aggregate of nano-scaled graphene platelets wherein each of the platelets comprises a graphene sheet or multiple graphene sheets and the platelets have a thickness no greater than 100 nm (preferably smaller than 10 nm) and platelets contact other platelets to define a plurality of conductive pathways along the article. The article has an exceptional thermal conductivity (typically greater than 500 WmK) and excellent electrical conductivity (typically greater than 1,000 S/cm). Thin-film articles of the present invention can be used for thermal management in micro-electronic devices and for current-dissipating on an aircraft skin against lightning strikes.


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