The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 2016
Filed:
Jun. 26, 2014
Applicant:
Stmicroelectronics S.r.i., Agrate Brianza, IT;
Inventors:
Assignee:
STMicroelectronics S.r.l., Agrate Brianza, IT;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81B 3/00 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01); B81C 3/00 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0021 (2013.01); B81B 7/0016 (2013.01); B81B 7/0058 (2013.01); B81C 1/00158 (2013.01); B81C 3/00 (2013.01); B81B 2201/0264 (2013.01); B81B 2203/0127 (2013.01); B81B 2207/115 (2013.01); B81C 2203/0118 (2013.01);
Abstract
A MEMS device wherein a die of semiconductor material has a first face and a second face. A diaphragm is formed in or on the die and faces the first surface. A cap is fixed to the first face of the die and has a hole forming a fluidic path connecting the diaphragm with the outside world. A closing region, for example a support, a second cap, or another die, is fixed to the second face of the die. The closing region forms, together with the die and the cap, a stop structure configured to limit movements of the suspended region in a direction perpendicular to the first face.