The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 2016
Filed:
Feb. 22, 2011
Myung Yung Jeong, Busan, KR;
Seung Hun OH, Busan, KR;
Jin Hwa Ryu, Ulsan, KR;
Sang Uk Cho, Gyeongsangnam-Do, KR;
Tae Ho Lee, Busan, KR;
Myung Yung Jeong, Busan, KR;
Seung Hun Oh, Busan, KR;
Jin Hwa Ryu, Ulsan, KR;
Sang Uk Cho, Gyeongsangnam-Do, KR;
Tae Ho Lee, Busan, KR;
Abstract
The disclosure relates to a method for manufacturing a photoaligning integrated large area metallic stamp, which includes the following steps: making a unit device PLC mold pattern, and molding a unit PLC device pattern through a multistep imprinting method using the PLC mold pattern; heat treating the unit PLC device pattern to minimize scattering loss due to surface roughness; making a groove pattern for supporting an optical fiber; making an integrated PDMS mold for a unit device by aligning the unit PLC device pattern and the groove pattern; and repeatedly replicating the integrated PDMS mold for a unit device to make a large area PDMS pattern, and making a large area stamp through electroforming using the large area PDMS pattern.