The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9233396 B1

PDF
Full Text
Expired
Date of Patent:
Jan. 12, 2016

Filed:

Aug. 02, 2013
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventor:

Byung-gil Jeong, Anyang-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 41/09 (2006.01); B06B 1/06 (2006.01); B06B 1/02 (2006.01);
U.S. Cl.
CPC ...
B06B 1/0629 (2013.01); B06B 1/0292 (2013.01);
Abstract

A micromachined ultrasonic transducer (MUT) array includes a printed circuit board, an alignment plate formed on the printed circuit board, the alignment plate having a plurality of cavities formed therein and a plurality of protruding portions respectively formed between neighboring cavities of the plurality of cavities, and a plurality of MUT modules formed on the plurality of the cavities and the plurality of the protruding portions of the alignment plate. In the MUT array, each of the plurality of MUT modules includes an application-specific integrated circuit (ASIC) arranged on the alignment plate and an MUT arranged on the ASIC.


Find Patent Forward Citations

Jeong, Byung-gil. (2016). Micromachined ultrasonic transducer array (U.S. Patent No. 9233396). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9233396

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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