The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 2016

Filed:

Jan. 16, 2013
Applicant:

Greatbatch Ltd., Clarence, NY (US);

Inventors:

Robert A. Stevenson, Canyon County, CA (US);

Thomas Marzano, East Amherst, NY (US);

Keith W. Seitz, Clarence Center, NY (US);

Steven W. Winn, Lancaster, NY (US);

Christine A. Frysz, Orchard Park, NY (US);

Richard L. Brendel, Carson City, NV (US);

Jason Woods, Carson City, NV (US);

Dominick J. Frustaci, Williamsville, NY (US);

Xiaohong Tang, Williamsville, NY (US);

William C. Thiebolt, Tonawanda, NY (US);

Assignee:

Greatbatch Ltd., Clarence, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G 4/35 (2006.01); A61N 1/375 (2006.01); A61N 1/05 (2006.01); H01G 2/10 (2006.01); H01R 43/00 (2006.01); A61N 1/372 (2006.01); C22C 29/12 (2006.01);
U.S. Cl.
CPC ...
A61N 1/3754 (2013.01); A61N 1/05 (2013.01); H01G 2/103 (2013.01); H01G 4/35 (2013.01); H01R 43/00 (2013.01); A61N 1/372 (2013.01); A61N 1/375 (2013.01); C22C 29/12 (2013.01); Y10T 156/1052 (2015.01);
Abstract

A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire.


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