The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2016
Filed:
Dec. 06, 2013
Applicant:
Fih (Hong Kong) Limited, Kowloon, HK;
Inventors:
Chwan-Hwa Chiang, New Taipei, TW;
Chieh-Hsiang Wang, New Taipei, TW;
Assignee:
FIH (Hong Kong) Limited, Kowloon, HK;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H05K 1/02 (2006.01); H05K 1/16 (2006.01); H05K 3/46 (2006.01); H04M 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0014 (2013.01); H05K 1/0284 (2013.01); H05K 1/162 (2013.01); H05K 3/4629 (2013.01); H04M 1/0202 (2013.01); H04M 1/0262 (2013.01); H04M 1/0277 (2013.01); H05K 2201/09018 (2013.01); H05K 2201/0999 (2013.01);
Abstract
A housing for an electronic device includes a ceramic base comprising ceramic material, at least one electronic element embedded in the ceramic base, and a buffer layer made of resin. The ceramic base includes an inner surface. The buffer layer is formed on the inner surface. A method for making the housing is also provided.