The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2016

Filed:

Apr. 02, 2010
Applicants:

Antti Iihola, Helsinki, FI;

Timo Jokela, Halikko, FI;

Inventors:

Antti Iihola, Helsinki, FI;

Timo Jokela, Halikko, FI;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H05K 1/18 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/188 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01L 2224/24227 (2013.01); H01L 2224/82039 (2013.01); H01L 2224/92144 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01015 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01057 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/07802 (2013.01); H05K 3/4602 (2013.01); H05K 3/4611 (2013.01); H05K 3/4652 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/0394 (2013.01); Y10T 29/4913 (2015.01); Y10T 29/49126 (2015.01); Y10T 29/49144 (2015.01); Y10T 29/49156 (2015.01);
Abstract

This publication discloses a method for manufacturing an electronic module, in which manufacture commences from an insulating-material sheet (). At least one recess () is made in the sheet () and extends through the insulating-material layer () as far as the conductive layer on the opposite surface (). A component () is set in the recess, with its contact surface towards the conductive layer and the component () is attached to the conductive layer. After this, a conductive pattern () is formed from the conductive pattern closing the recess, which is electrically connected from at least some of the contact areas or contact protrusions of the component () set in the recess.


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