The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2016
Filed:
Nov. 11, 2013
Applicant:
Jx Nippon Mining & Metals Corporation, Tokyo, JP;
Inventors:
Hideta Arai, Hitachi, JP;
Atsushi Miki, Hitachi, JP;
Kohsuke Arai, Hitachi, JP;
Kaichiro Nakamuro, Kanagawa, JP;
Assignee:
JX Nippon Mining & Metals Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); B32B 15/08 (2006.01); B32B 3/00 (2006.01); H05K 1/05 (2006.01); C25D 1/04 (2006.01); H05K 3/38 (2006.01); C25D 5/16 (2006.01); C25D 7/06 (2006.01); H05K 1/14 (2006.01); H05K 3/36 (2006.01); H05K 3/02 (2006.01); C25D 3/38 (2006.01); C25D 3/58 (2006.01);
U.S. Cl.
CPC ...
H05K 1/056 (2013.01); C25D 1/04 (2013.01); C25D 5/16 (2013.01); C25D 7/0692 (2013.01); H05K 1/09 (2013.01); H05K 1/14 (2013.01); H05K 3/36 (2013.01); H05K 3/384 (2013.01); C25D 3/38 (2013.01); C25D 3/58 (2013.01); H05K 3/022 (2013.01);
Abstract
A surface treated copper foil which is well bonded to a resin and allows the resin to have excellent transparency after removal of the copper foil by etching, and a laminate using the same are provided. A surface treated copper foil having at least one surface with a skewness Rsk of −0.35 to 0.53, comprising an Sv defined by the following expression (1) of 3.5 or more based on a brightness curve:=(Δ×0.1)/(1−2)  (1);