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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9232645 B1

PDFFull Text
Date of Patent:
Jan. 05, 2016

Filed:

Nov. 22, 2013

High speed differential wiring in glass ceramic mcms

Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Jinwoo Choi, Austin, TX (US);

Daniel M. Dreps, Georgetown, TX (US);

Rohan U. Mandrekar, Sunnyvale, CA (US);

Assignee:

International Business Machines Corporation, Armonk, NY (US);

Attorney:

Scully, Scott, Murphy & Presser, P.C.

Primary Examiner:

Yu Chen

Assistant Examiner:

Nilufa Rahim

Int. Cl.
CPC ...
H01L 23/528 (2006.01); H05K 1/02 (2006.01); C04B 37/00 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01); H01L 21/48 (2006.01); H05K 3/12 (2006.01); H01L 23/522 (2006.01); H05K 1/09 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01); H05K 3/00 (2006.01); H05K 3/24 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0298 (2013.01); C04B 37/006 (2013.01); H01L 23/528 (2013.01); H01L 23/5283 (2013.01); H05K 1/0245 (2013.01); H05K 1/0306 (2013.01); H05K 3/1291 (2013.01); H05K 3/4667 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 21/4867 (2013.01); H01L 23/13 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/5226 (2013.01); H01L 2924/0002 (2013.01); H05K 1/092 (2013.01); H05K 3/005 (2013.01); H05K 3/1216 (2013.01); H05K 3/1233 (2013.01); H05K 3/245 (2013.01); H05K 2201/035 (2013.01); H05K 2201/0338 (2013.01); H05K 2201/09272 (2013.01); H05K 2201/09709 (2013.01); H05K 2203/0126 (2013.01); H05K 2203/063 (2013.01);
Abstract

The embodiments of the present invention relate generally to the fabrication of integrated circuits, and more particularly to a structure and method for fabricating differential wiring patterns in multilayer glass-ceramic (MLC) modules. A structure and method of forming a MLC having layers with staggered, or offset, pairs of lines formed directly on one another are disclosed. In addition, a structure and method of forming a MLC having layers with staggered, or offset, pairs of lines that periodically reverse polarity are disclosed.

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