The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2016

Filed:

Jul. 12, 2013
Applicant:

Inpaq Technology Co., Ltd., Miaoli, TW;

Inventors:

Shin Min Tai, Taoyuan County, TW;

Chien Heng Chen, Kaohsiung, TW;

Wei Chuan Chen, Taoyuan County, TW;

Yu Chia Chang, Taichung, TW;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03H 7/01 (2006.01); H03H 7/42 (2006.01); H03H 1/00 (2006.01);
U.S. Cl.
CPC ...
H03H 7/427 (2013.01); H03H 2001/0085 (2013.01);
Abstract

A common mode filter with a multi-spiral layer structure includes a first coil, a first insulating layer, a second coil, a second insulating layer, a third coil, a third insulating layer, and a fourth coil, wherein the first coil serially connects with the fourth coil, and the second coil serially connects with the third coil. A first conductive pillar is configured to connect the first coil and the fourth coil, and a second conductive pillar is configured to connect the second coil and the third coil, wherein the first conductive pillar and the second conductive pillar are internally diagonally disposed relatively within a corner or the same side of corners of the rectangular spiral.


Find Patent Forward Citations

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Tai, Shin. (2016). Common mode filter with multi-spiral layer structure and method of manufacturing the same (U.S. Patent No. 9231551). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9231551

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