The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2016
Filed:
Nov. 11, 2014
Applicant:
Panasonic Corporation, Osaka, JP;
Inventors:
Yukio Okazaki, Osaka, JP;
Akinori Daimo, Hyogo, JP;
Assignee:
PANASONIC CORPORATION, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F 3/217 (2006.01); H03F 1/04 (2006.01); H03F 1/02 (2006.01); H03F 1/32 (2006.01);
U.S. Cl.
CPC ...
H03F 1/0205 (2013.01); H03F 1/3294 (2013.01); H03F 3/2171 (2013.01); H03F 3/2178 (2013.01); H03F 2200/309 (2013.01); H03F 2203/21139 (2013.01);
Abstract
An SCPA includes a pad, capacitative elements, amplifiers on an IC chip. The capacitative elements are disposed on a first circle whose center is located on the pad. The amplifiers which correspond to the capacitative elements are disposed on a second circle which is a concentric circle larger than the first circle. The pad, each of the capacitative elements, and a corresponding one of the amplifiers are aligned in a line so that the length of wiring is the shortest.