The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2016
Filed:
Mar. 18, 2013
Applicant:
Seiko Epson Corporation, Tokyo, JP;
Inventors:
Matsutaro Naito, Kamiina, JP;
Hideo Endo, Kamiina, JP;
Assignee:
Seiko Epson Corporation, , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/02 (2006.01); H03H 9/19 (2006.01); H01L 41/053 (2006.01); H03H 9/17 (2006.01);
U.S. Cl.
CPC ...
H01L 41/053 (2013.01); H03H 9/02062 (2013.01); H03H 9/02157 (2013.01); H03H 9/177 (2013.01); H03H 9/19 (2013.01);
Abstract
When a length along a vibrating direction of the thickness shear vibration of a multi-stage type mesa substrate of A resonator element is x, a thickness of the vibration section is t, and a distance between the vibration section and the bonding region is y, y is in a range of −0.0151×(x/t)+0.3471≦y≦−0.0121×(x/t)+0.3471.