The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2016

Filed:

Aug. 28, 2012
Applicants:

Murray C. Thom, Vancouver, CA;

Alexander M. Tcaciuc, New Westminster, CA;

Gordon Lamont, New Westminster, CA;

Jacob Craig Petroff, Vancouver, CA;

Richard David Neufeld, Burnaby, CA;

David S. Bruce, Burnaby, CA;

Sergey V. Uchaykin, Burnaby, CA;

Inventors:

Murray C. Thom, Vancouver, CA;

Alexander M. Tcaciuc, New Westminster, CA;

Gordon Lamont, New Westminster, CA;

Jacob Craig Petroff, Vancouver, CA;

Richard David Neufeld, Burnaby, CA;

David S. Bruce, Burnaby, CA;

Sergey V. Uchaykin, Burnaby, CA;

Assignee:

D-Wave Systems Inc., Burnaby, CA;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03H 7/01 (2006.01); H01L 39/14 (2006.01); H01F 6/06 (2006.01); H01L 39/02 (2006.01);
U.S. Cl.
CPC ...
H01L 39/14 (2013.01); H01L 39/02 (2013.01); H01F 6/06 (2013.01); H03H 7/0115 (2013.01); H03H 7/0138 (2013.01); H03H 7/1741 (2013.01);
Abstract

Systems and devices for providing differential input/output communication with a superconducting device are described. Each differential I/O communication is electrically filtered using a respective tubular filter structure incorporating superconducting lumped element devices and high frequency dissipation by metal powder epoxy. A plurality of such tubular filter structures is arranged in a cryogenic, multi-tiered assembly further including structural/thermalization supports and a device sample holder assembly for securing a device sample, for example a superconducting quantum processor. The interface between the cryogenic tubular filter assembly and room temperature electronics is achieved using hermetically sealed vacuum feed-through structures designed to receive flexible printed circuit board cable.


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