The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2016
Filed:
May. 02, 2014
Industrial Technology Research Institute, Hsinchu, TW;
Re-Ching Lin, Taichung, TW;
Shih-Yi Wen, Taipei, TW;
Chen-Peng Hsu, Hsinchu, TW;
Hung-Lieh Hu, Hsinchu, TW;
Yu-Chen Yu, Hsinchu County, TW;
Chia-Fen Hsieh, Hsinchu County, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
A light-emitting diode package structure including a chip carrier portion, a light-emitting diode chip, and a package material is provided. The light-emitting diode chip is disposed on the chip carrier portion of the package. The package material is filled in the chip carrier portion and covers the light-emitting diode chip. The package material includes a matrix material, a plurality of first powder particles, and a plurality of second powder particles. The first powder particles and the second powder particles are distributed in the matrix material. Each first powder particle is a wavelength conversion material. Each second powder particle has a shell-like structure.