The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2016

Filed:

Nov. 13, 2014
Applicant:

Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;

Inventors:

Naoaki Nakamura, Kawasaki, JP;

Makoto Suwada, Kawasaki, JP;

Assignee:

FUJITSU LIMITED, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/50 (2006.01); H01L 27/105 (2006.01); H01L 23/48 (2006.01); H01L 23/66 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1052 (2013.01); H01L 23/481 (2013.01); H01L 23/66 (2013.01); H01L 25/0657 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/05568 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/17181 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06565 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1432 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/1436 (2013.01);
Abstract

A semiconductor device includes: a first semiconductor chip having a first antenna that is formed in a first hole provided in the first semiconductor chip, has an inclined surface inclined with respect to a central line of the first hole, and transmits and receives a radio wave; and a second semiconductor chip stacked over the first semiconductor chip, the second semiconductor chip having a second antenna that is formed in a second hole provided in the second semiconductor chip, has an inclined surface inclined with respect to a central line of the second hole, and transmits and receives a radio wave, wherein the first antenna and the second antenna are disposed so that the inclined surface of the first antenna and the inclined surface of the second antenna face each other.


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