The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2016

Filed:

Sep. 13, 2013
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Kenneth J. Goodnow, Essex Junction, VT (US);

Todd E. Leonard, Williston, VT (US);

Stephen G. Shuma, Underhill, VT (US);

Peter A. Twombly, Shelburne, VT (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 25/065 (2006.01); H01L 31/042 (2014.01); H01L 35/00 (2006.01); H01M 12/00 (2006.01); H01L 31/053 (2014.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 31/042 (2013.01); H01L 31/053 (2014.12); H01L 35/00 (2013.01); H01M 12/00 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16145 (2013.01); H01L 2225/06541 (2013.01);
Abstract

Structures and methods for self-powered devices are disclosed herein. Specifically, disclosed herein is a stacked, three-dimensional integrated circuit including a power generation die including a power source. The integrated circuit also includes a functional system die including one or more functional components that are powered by power generated by the power source. The power generation die and the functional system die are stacked in a three-dimensional structure.


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