The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2016

Filed:

Oct. 09, 2014
Applicant:

Commissariat a L'energie Atomique ET Aux Ene Alt, Paris, FR;

Inventors:

Yann Lamy, Saint Etienne de Crossey, FR;

Alain Merle, Quaix en Chartreuse, FR;

Guy-Michel Parat, Claix, FR;

Assia Tria, Auriol, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 49/02 (2006.01); H01L 21/768 (2006.01); G06F 21/86 (2013.01); H01L 29/66 (2006.01); H01L 29/94 (2006.01); H01L 27/02 (2006.01); H01L 27/06 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 23/573 (2013.01); G06F 21/86 (2013.01); H01L 21/76816 (2013.01); H01L 23/576 (2013.01); H01L 27/0203 (2013.01); H01L 27/0694 (2013.01); H01L 28/40 (2013.01); H01L 29/66181 (2013.01); H01L 29/945 (2013.01); H01L 23/5223 (2013.01); H01L 23/5227 (2013.01); H01L 2224/06515 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19104 (2013.01); H01L 2924/30105 (2013.01); H01L 2924/30107 (2013.01);
Abstract

An electronic chip is provided, including an electronic circuit located at a front face of a substrate; a capacitive element placed at a back face of the substrate and facing the electronic circuit, and electrically connected to the electronic circuit by a first electrical connection and a second electrical connection, the first electrical connection including at least a first electrically conducting via passing through the substrate, the electronic circuit being configured to measure a value of electrical capacitance of the capacitive element between the first and the second electrical connections; and a plurality of second vias or trenches passing through the back face of the substrate and a part of the thickness of the substrate, and extending toward the electronic circuit such that bottom walls of the plurality of second vias or trenches are separated from the electronic circuit by at least one non-zero distance.


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