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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9230878 B1

PDFFull Text
Date of Patent:
Jan. 05, 2016

Filed:

Apr. 12, 2013

Integrated circuit package for heat dissipation

Applicant:

Lenovo Enterprise Solutions (Singapore) Pte. Ltd., Singapore, SG;

Inventors:

Anthony E. Baker, Stittsville, CA;

Stephen J. Flint, Ottawa, CA;

Jian Meng, Kanata, CA;

Assignee:

Lenovo Enterprise Solutions (Singapore) Pte. Ltd., Singapore, SG;

Attorney:

Zilka-Kotab, PC

Primary Examiner:

Anthony Haughton

Assistant Examiner:

Razmeen Gafur

Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 23/42 (2006.01); H01L 23/473 (2006.01); H01L 23/40 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 23/3735 (2013.01); H01L 23/42 (2013.01); H01L 23/3736 (2013.01); H01L 23/3737 (2013.01); H01L 23/4093 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/83385 (2013.01);
Abstract

An apparatus for enclosing an electronic component to a base comprising, an enclosure attached to a base and surrounding an electronic component. The enclosure divided into a first portion and a second portion along a first plane substantially parallel to the base. The second portion of the enclosure is attached to the base. The first portion of the enclosure is attached to the second portion of the enclosure. The enclosure including one or more extruding elements on an exterior surface of the enclosure. The one or more extruding elements on the exterior surface of the enclosure increases an exterior surface area of the enclosure facilitating dissipation of heat from the electronic component.

Find Patent Forward Citations

Baker, Anthony. (2016). Integrated circuit package for heat dissipation (U.S. Patent No. 9230878). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9230878

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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