The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2016
Filed:
Jun. 17, 2011
Applicant:
Koichi Hashimoto, Shiga, JP;
Inventor:
Koichi Hashimoto, Shiga, JP;
Assignee:
NIPPON ELECTRIC GLASS CO., LTD., Otsu-shi, Shiga, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); C03C 8/02 (2006.01); C03C 3/068 (2006.01); C03C 3/095 (2006.01); C03C 8/24 (2006.01); H01L 33/56 (2010.01);
U.S. Cl.
CPC ...
H01L 23/291 (2013.01); C03C 3/068 (2013.01); C03C 3/095 (2013.01); C03C 8/24 (2013.01); H01L 33/56 (2013.01); H01L 2924/0002 (2013.01);
Abstract
The technical task of the present invention is to provide a lead-free glass for semiconductor encapsulation, which is easy to automate an appearance inspection, and furthermore, has excellent refinability and encapsulatability of semiconductor devices. In the lead-free glass for semiconductor encapsulation according to the present invention, a temperature at which the viscosity of glass is 10dPa·s is 670° C. or lower, and, as a glass composition, the content of CeOis from 0.01 to 6% by mass, and the content of SbOis 0.1% by mass or less.