The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2016

Filed:

Nov. 03, 2011
Applicants:

Klaus Telgenbüscher, Hamburg, DE;

Judith Grünauer, Hamburg, DE;

Jan Ellinger, Hamburg, DE;

Inventors:

Klaus Telgenbüscher, Hamburg, DE;

Judith Grünauer, Hamburg, DE;

Jan Ellinger, Hamburg, DE;

Assignee:

TESA SE, Hamburg, SE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 51/52 (2006.01);
U.S. Cl.
CPC ...
H01L 21/56 (2013.01); H01L 21/561 (2013.01); H01L 23/3121 (2013.01); H01L 51/5253 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/12044 (2013.01);
Abstract

The invention relates to a method for encapsulating an electronic arrangement against permeants, wherein an electronic arrangement is made available on a substrate, wherein, in a vacuum, that area of the substrate which embraces that region of the electronic arrangement which is to be encapsulated, preferably said area and that region of the electronic arrangement which is to be encapsulated, is brought into contact with a sheet material comprising at least one adhesive compound and a composite is produced therefrom. The invention also relates to an apparatus for implementing the method and to an encapsulated electronic arrangement produced thereby.


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