The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2016
Filed:
Feb. 23, 2011
Applicants:
Yong Hyup Kim, Seoul, KR;
Wal Jun Kim, Seoul, KR;
Inventors:
Yong Hyup Kim, Seoul, KR;
Wal Jun Kim, Seoul, KR;
Assignee:
SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION, Seoul, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 19/06 (2006.01); H01K 1/04 (2006.01); H01J 9/02 (2006.01); H01B 1/04 (2006.01); H01B 1/08 (2006.01); H01J 1/304 (2006.01); B23H 9/00 (2006.01);
U.S. Cl.
CPC ...
H01J 9/025 (2013.01); B23H 9/00 (2013.01); H01B 1/04 (2013.01); H01B 1/08 (2013.01); H01J 1/304 (2013.01); H01J 1/3044 (2013.01); H01J 2201/30411 (2013.01); H01J 2201/30434 (2013.01); H01J 2201/30449 (2013.01); H01J 2201/30469 (2013.01);
Abstract
The present invention relates to a conductive nanostructure, a method for molding the same, and a method for manufacturing a field emitter using the same. More particularly, the present invention relates to a field-emitting nanostructure comprising a conductive substrate, a conductive nanostructure arranged on the conductive substrate, and a conductive interfacial compound disposed in the interface between the conductive substrate and the conductive nanostructure, as well as to a method for molding the same, and a method for manufacturing a field emitter using the same.