The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2016
Filed:
Feb. 08, 2013
Applicant:
Jsp Corporation, Tokyo, JP;
Inventors:
Assignee:
JSP CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/06 (2006.01); H01B 1/24 (2006.01); C08J 9/224 (2006.01); B29B 9/06 (2006.01); B29K 23/00 (2006.01); B29K 105/04 (2006.01); B29K 507/04 (2006.01);
U.S. Cl.
CPC ...
H01B 1/24 (2013.01); B29B 9/06 (2013.01); C08J 9/224 (2013.01); B29K 2023/06 (2013.01); B29K 2023/12 (2013.01); B29K 2105/04 (2013.01); B29K 2507/04 (2013.01); B29K 2995/0005 (2013.01); C08J 2201/038 (2013.01); C08J 2323/12 (2013.01); C08J 2423/06 (2013.01);
Abstract
An electrostatic dissipative, polypropylene-based resin expanded bead having an expanded core layer of a polypropylene-based resin, and a cover layer that covers the expanded core layer and that is composed of a mixed resin containing electrically conductive carbon black, wherein the mixed resin includes a polypropylene resin which forms a continuous phase and a polyethylene resin which forms dispersed phases dispersed in the continuous phase, with the electrically conductive carbon black being unevenly distributed to the dispersed phases side. In-mold molding of the expanded beads gave a molded article.