The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2016

Filed:

Apr. 17, 2014
Applicant:

Chicony Electronics Co., Ltd., New Taipei, TW;

Inventors:

I-Heng Chen, Taipei Hsien, TW;

Chung-Yao Lin, Taipei Hsien, TW;

Yu-Hsiu Lin, Taipei Hsien, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01); G06F 3/02 (2006.01); B32B 5/24 (2006.01); B32B 9/02 (2006.01); B32B 9/04 (2006.01); B32B 7/12 (2006.01);
U.S. Cl.
CPC ...
G06F 3/0202 (2013.01); B32B 5/245 (2013.01); B32B 7/12 (2013.01); B32B 9/025 (2013.01); B32B 9/046 (2013.01); B32B 2262/0261 (2013.01); B32B 2266/0278 (2013.01); B32B 2457/00 (2013.01);
Abstract

A covering structure including a bottom covering layer, a top covering layer, and a thermoplastic material layer is disclosed. The thermoplastic material layer is laminated between the bottom covering layer and the top covering layer. The thermoplastic material layer includes a first thermoplastic material layer part and a second thermoplastic material layer part that are connected to each other. The first thermoplastic material layer part has a first thickness. The second thermoplastic material layer part has a second thickness. The first thickness is larger than the thickness of the top covering layer. The first thickness is 4˜7 times of the second thickness. The disclosure further discloses an input device using the covering structure and a manufacturing method of the covering structure.


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