The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2016

Filed:

Jun. 24, 2013
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventor:

Takayuki Teshima, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G21K 1/06 (2006.01); G01N 23/20 (2006.01);
U.S. Cl.
CPC ...
G01N 23/20008 (2013.01); G21K 1/06 (2013.01); G21K 1/062 (2013.01); G21K 2207/005 (2013.01);
Abstract

A method for producing a structure includes the steps of etching a first substrate of an integrated member including, in sequence, the first substrate, an etching stop layer, and a seed layer, from a surface of the first substrate opposite the surface adjacent to the etching stop layer to form a hole or a plurality of gaps in the first substrate in such a manner that part of a surface of the etching stop layer is exposed, partially etching the etching stop layer from the surface of the etching stop layer exposed to expose part of a surface of the seed layer, and forming a metal member by plating using the seed layer as a seed to charge a metal into at least part of the hole or the gaps.


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