The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2016

Filed:

Dec. 14, 2011
Applicants:

Nirmal Sharma, Shrewsbury, MA (US);

Virgil Ararao, Rutland, MA (US);

Leonardo T. Magpantay, Paranaque, PH;

Raymond W. Engle, Southbridge, MA (US);

William P. Taylor, Amherst, NH (US);

Kirsten Doogue, Manchester, NH (US);

Jay Gagnon, Holden, MA (US);

Inventors:

Nirmal Sharma, Shrewsbury, MA (US);

Virgil Ararao, Rutland, MA (US);

Leonardo T. Magpantay, Paranaque, PH;

Raymond W. Engle, Southbridge, MA (US);

William P. Taylor, Amherst, NH (US);

Kirsten Doogue, Manchester, NH (US);

Jay Gagnon, Holden, MA (US);

Assignee:

Allegro Microsystems, LLC, Worcester, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/10 (2006.01); H05K 7/12 (2006.01); G01D 11/24 (2006.01); G01R 33/07 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
G01D 11/245 (2013.01); G01R 33/07 (2013.01); H01L 23/49589 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/3011 (2013.01);
Abstract

Methods and apparatus for a magnetic field sensor in a molded IC package having a magnetic field sensing element in a die with a component coupled to a leadframe at a downset area. In embodiments, a thickness of the leadframe in the downset area is less than a thickness of the leadframe in a non-downset area adjacent to the downset area.


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