The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2016
Filed:
Dec. 14, 2011
Satoshi Hayashi, Osaka, JP;
Satoshi Hayashi, Osaka, JP;
SEKISUI CHEMICAL CO., LTD., Osaka, JP;
Abstract
An object of the present invention is to provide a method for producing polyamide acid particles which is used as a raw material for polyimide particles with a small average particle diameter having high heat resistance. Other objects of the present invention are to provide a method for producing polyimide particles using the method for producing polyamide acid particles, and polyimide particles produced by the method for producing polyimide particles. Yet another object of the present invention is to provide a bonding material for an electronic component, which has a low linear expansion coefficient and a low elastic modulus after being cured in the temperature range equal to or less than the glass transition temperature, so that a joined body with high reliability can be produced. The present invention is a method for producing polyamide acid particles having a step of preparing a solution having a diamine compound dissolved, and a step of precipitating polyamide acid particles by adding a tetracarboxylic anhydride in a non-solution state to the solution having a diamine compound dissolved while applying a physical impact thereto.