The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2016

Filed:

Nov. 15, 2013
Applicant:

AU Optronics Corp., Hsin-Chu, TW;

Inventors:

Keh-Long Hwu, Hsin-Chu, TW;

Pin-Fan Wang, Hsin-Chu, TW;

Chih-Jen Hu, Hsin-Chu, TW;

Assignee:

AU Optronics Corp., Science-Based Industrial Park, Hsin-Chu, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B 38/10 (2006.01); C09J 5/00 (2006.01); B32B 7/06 (2006.01); B32B 7/12 (2006.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
C09J 5/00 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 2405/00 (2013.01); H01L 27/1218 (2013.01); Y10T 156/1195 (2015.01); Y10T 428/2486 (2015.01);
Abstract

A method of fabricating a flexible substrate structure includes the following steps. A supporting carrier is provided, and a release layer is formed on the supporting carrier, where the release layer includes a photo-sensitive adhesive layer. A local modification process is performed to form a bonding region with adhesion property in modified parts of the release layer, and to form a release region without adhesion property in unmodified parts of the release layer. The local modification process includes performing a local exposure process with a light source to form the bonding region with adhesion property in illuminated parts of the release layer, and to form a release region without adhesion property in unilluminated parts of the release layer.


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