The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2016
Filed:
Jan. 29, 2014
Applicant:
Cytec Technology Corp., Wilmington, DE (US);
Inventors:
Paul Mark Cross, York, GB;
Richard Thomas Price, Corona, CA (US);
Dominique Ponsolle, Winona, MN (US);
Patrick Terence McGrail, Saltburn, GB;
Assignee:
Cytec Technology Corp., Wilmington, DE (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/50 (2006.01); C08G 59/56 (2006.01); C08L 61/02 (2006.01); C08L 65/02 (2006.01); C08L 71/12 (2006.01); C08L 81/06 (2006.01); C08G 59/40 (2006.01); C08L 63/00 (2006.01);
U.S. Cl.
CPC ...
C08L 71/12 (2013.01); C08G 59/4021 (2013.01); C08G 59/5033 (2013.01); C08L 61/02 (2013.01); C08L 65/02 (2013.01); C08L 81/06 (2013.01);
Abstract
A thermoplastic polymer toughening material in the form of polymeric fibers produced by mixing at least one epoxy curing agent and a thermoplastic polyaromatic polymer to form an admixture, and producing polymeric fibers from the admixture, wherein the thermoplastic polymer toughening material does not include an epoxy resin, and is soluble in an epoxy resin at a temperature lower than a dissolving temperature required by the thermoplastic polymer toughening material without epoxy curing agent.