The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2016

Filed:

Feb. 27, 2013
Applicant:

Electro Scientific Industries, Inc., Portland, OR (US);

Inventors:

Hisashi Matsumoto, Hillsboro, OR (US);

Haibin Zhang, Portland, OR (US);

Glenn Simenson, Portland, OR (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03B 21/06 (2006.01); C03B 17/06 (2006.01); C03B 21/02 (2006.01); C03B 33/09 (2006.01); B32B 3/26 (2006.01); B23K 26/40 (2014.01); B23K 26/06 (2014.01); B23K 26/08 (2014.01); B23K 26/38 (2014.01);
U.S. Cl.
CPC ...
C03B 33/091 (2013.01); B23K 26/063 (2013.01); B23K 26/083 (2013.01); B23K 26/0807 (2013.01); B23K 26/0815 (2013.01); B23K 26/381 (2013.01); B23K 26/386 (2013.01); B23K 26/4075 (2013.01); B32B 3/266 (2013.01);
Abstract

Methods and apparatus for machining substrates are disclosed, as are articles formed from the separated substrates. A method of machining a substrate having a first surface and a second surface opposite the first surface can include forming a first recess in the substrate extending from the first surface toward the second surface, forming a second recess in the substrate extending from the second surface toward the first surface, and removing a portion of the substrate extending from the first recess to the second recess to form an opening in the substrate.


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