The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2016
Filed:
Jan. 14, 2015
Applicant:
Miramems Sensing Technology Co., Ltd., Suzhou, CN;
Inventors:
Yu-Hao Chien, Taipei, TW;
Li-Tien Tseng, Taoyuan County, TW;
Assignee:
MIRAMEMS SENSING TECHNOLOGY CO., LTD, Suzhou, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/54 (2006.01); B81B 3/00 (2006.01); B81B 7/00 (2006.01); B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0005 (2013.01); B81B 7/007 (2013.01); B81C 1/00238 (2013.01); B81C 1/00373 (2013.01); B81B 2201/0264 (2013.01);
Abstract
A pressure sensor using the MEMS element and the manufacture method thereof utilize the semiconductor processes to form the micro channel connecting to the chamber, open the micro channel, coat the anti-sticking layer on the inner surface of the chamber, and then seal the micro channel to keep the chamber airtight. Therefore, the manufacture method may essentially simplify the process to coat the anti-sticking layer on the inner surface of the airtight chamber to prevent the sticking and failing of the movable MEMS element.