The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 05, 2016
Filed:
Jun. 03, 2011
Hidetaka Hattori, Tokyo, JP;
Hideki Horizono, Tokyo, JP;
Takaaki Sato, Tokyo, JP;
Tadashi Yazaki, Tokyo, JP;
Hidetaka Hattori, Tokyo, JP;
Hideki Horizono, Tokyo, JP;
Takaaki Sato, Tokyo, JP;
Tadashi Yazaki, Tokyo, JP;
MITSUBISHI HEAVY INDUSTRIES, LTD., Tokyo, JP;
Abstract
A method for manufacturing a resin-based composite material includes: a stage in which prepregs are stacked on a jig; a stage in which the stacked prepregs and the jig are covered and pressurized heat treatment is applied thereto to form a first semi-molded article and a second semi-molded article; a stage in which board thicknesses of the first semi-molded article and the second semi-molded article are measured, a stage in which the number of additional plies is determined based on the measured board thicknesses, a desired board thickness of the resin-based composite material, and physical properties of the additional plies; and a stage in which a layered product is formed by stacking the predetermined number of additional plies between the first semi-molded article and the second semi-molded article, the layered product and the jig are covered with a bagging material, and pressurized heat treatment is applied thereto.