The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2016

Filed:

Nov. 17, 2011
Applicants:

Hiroyuki Kurimura, Shibukawa, JP;

Hayato Miyazaki, Shibukawa, JP;

Inventors:

Hiroyuki Kurimura, Shibukawa, JP;

Hayato Miyazaki, Shibukawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/02 (2006.01); C03B 33/07 (2006.01); C09J 4/00 (2006.01); C09J 5/00 (2006.01);
U.S. Cl.
CPC ...
B32B 37/02 (2013.01); C03B 33/076 (2013.01); C09J 4/00 (2013.01); C09J 5/00 (2013.01); C09J 2205/31 (2013.01); C09J 2433/00 (2013.01); Y10T 156/11 (2015.01);
Abstract

There is provided a method by which it is possible to precisely process a translucent rigid substrate laminate. The method for processing a translucent rigid substrate laminate includes the steps of: preparing a translucent rigid substrate laminate by adhering two or more translucent rigid substrates with photocurable adhering agent; fixing the laminate to a cradle with predetermined adhesive; performing processing A for cutting the laminate, which is fixed to the cradle, in a thickness direction and forming a desired number of divided translucent rigid substrate laminates, or performing desired outline processing B on the laminate which is fixed to the cradle; and peeling the processed translucent rigid substrate laminate from the cradle by applying external force without heating the translucent rigid substrate laminate at 40° C. or more.


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