The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2016

Filed:

Aug. 13, 2014
Applicant:

William Engineering Llc, Attleboro, MA (US);

Inventors:

Paul A. Dion, North Attleboro, MA (US);

Gregg A. Dion, North Attleboro, MA (US);

Assignee:

William Engineering LLC, North Attleboro, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 20/00 (2006.01); B23K 20/04 (2006.01); B23K 11/14 (2006.01); B23K 20/02 (2006.01); B23K 31/02 (2006.01); C22C 38/00 (2006.01); C22C 38/18 (2006.01); B23K 11/02 (2006.01);
U.S. Cl.
CPC ...
B23K 11/14 (2013.01); B23K 11/02 (2013.01); B23K 20/023 (2013.01); B23K 20/028 (2013.01); B23K 31/02 (2013.01); C22C 38/00 (2013.01); C22C 38/18 (2013.01);
Abstract

A method of solid phase bonding metal pieces by securing a first and second metal pieces in edge to edge contact; subjecting the first and second metal pieces to a first upset comprising heating the first and second edges to a temperature in the range of 0.35-0.95 of the melting temperature of the first and second metal pieces and applying a first axil force to the first and second metal pieces to urge the first and second edges together, to upset the metal at the edge to edge contact and form a bond; and subjecting the bonded metal piece to a second upset comprising heating the bonded metal piece between secured locations to a temperature in the range of 0.35-0.95 of the melting temperature of the metal and applying a second axil force to the bonded metal piece to upset the bonded metal piece and form a solid phase bond.


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