The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2016

Filed:

Mar. 12, 2013
Applicant:

Seagate Technology Llc, Cupertino, CA (US);

Inventors:

Jon Paul Hurley, Bloomington, MN (US);

Bernard W. Bell, Jr., Lafayette, CO (US);

Steven Harlow Anderson Axdal, Cottage Grove, MN (US);

Assignee:

SEAGATE TECHNOLOGY LLC, Cupertino, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01S 5/02 (2006.01); B23K 1/00 (2006.01); G11B 13/04 (2006.01); H01L 23/488 (2006.01); G11B 5/105 (2006.01); B23K 35/24 (2006.01); H01L 21/60 (2006.01); G11B 5/00 (2006.01);
U.S. Cl.
CPC ...
B23K 1/0008 (2013.01); G11B 5/105 (2013.01); G11B 13/04 (2013.01); H01L 23/488 (2013.01); H01S 5/0216 (2013.01); B23K 35/24 (2013.01); G11B 2005/0021 (2013.01); H01L 2021/60022 (2013.01); H01L 2225/06517 (2013.01); H05K 2201/10674 (2013.01);
Abstract

A heat assisted magnetic recording (HAMR) assembly includes a slider, a laser diode and solder connections between the laser diode and the slider. The solder connections mechanically and electrically attach the laser diode to the slider. Each solder connection has a total volume per unit area (i.e., height) of less than or equal to about 15 μm. The solder connections have a first intermetallic zone adjacent to the laser diode, a second intermetallic zone adjacent to the slider, and a eutectic zone of eutectic material between the first and second intermetallic zones. The eutectic zone occupies greater than or equal to about 35% of the total volume per unit area of the solder connection.


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