The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 29, 2015

Filed:

Feb. 03, 2014
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Joseph Fisher, Jr., San Jose, CA (US);

Sean Mayo, Mountain View, CA (US);

Dennis R. Pyper, San Jose, CA (US);

Paul Nangeroni, Mountain View, CA (US);

Jose Mantovani, Los Altos, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2006.01); H05K 9/00 (2006.01); H05K 3/28 (2006.01); H01L 23/552 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0084 (2013.01); H01L 23/552 (2013.01); H05K 3/284 (2013.01); H05K 9/0092 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/15192 (2013.01); H05K 2201/0715 (2013.01); H05K 2201/09509 (2013.01);
Abstract

Electrical components such as integrated circuits may be mounted on a printed circuit board. To prevent the electrical components from being subjected to electromagnetic interference, radio-frequency shielding structures may be formed over the components. The radio-frequency shielding structures may be formed from a layer of metallic paint. Components may be covered by a layer of dielectric. Channels may be formed in the dielectric between blocks of circuitry. The metallic paint may be used to coat the surfaces of the dielectric and to fill the channels. Openings may be formed in the surface of the metallic paint to separate radio-frequency shields from each other. Conductive traces on the surface of the printed circuit board may be used in connecting the metallic paint layer to internal printed circuit board traces.


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