The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2015
Filed:
Mar. 07, 2013
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon, KR;
Inventors:
Kwang Soo Kim, Suwon, KR;
Tae Hyun Kim, Suwon, KR;
Bum Seok Suh, Suwon, KR;
In Wha Jeong, Suwon, KR;
Young Ki Lee, Suwon, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 25/07 (2006.01);
U.S. Cl.
CPC ...
H05K 7/209 (2013.01); H01L 23/367 (2013.01); H01L 23/49833 (2013.01); H01L 23/49861 (2013.01); H01L 25/072 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48229 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/15159 (2013.01);
Abstract
There is provided a power semiconductor module in which power semiconductor elements, integration of which may be difficult due to heating, are modularized. The power semiconductor module includes: a heat dissipation substrate electrically connected to a common connection terminal; and a plurality of electronic elements disposed on the heat dissipation substrate, wherein the electronic elements have varying spaces therebetween.