The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 29, 2015

Filed:

Jul. 09, 2014
Applicant:

Eastman Kodak Company, Rochester, NY (US);

Inventors:

Hwei-Ling Yau, Rochester, NY (US);

David Paul Trauernicht, Rochester, NY (US);

John Andrew Lebens, Rush, NY (US);

Yongcai Wang, Rochester, NY (US);

Ronald Steven Cok, Rochester, NY (US);

Assignee:

EASTMAN KODAK COMPANY, Rochester, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 3/06 (2006.01); H05K 3/46 (2006.01); G06F 3/044 (2006.01);
U.S. Cl.
CPC ...
H05K 3/467 (2013.01); G06F 3/044 (2013.01);
Abstract

A method of making a multi-layer micro-wire structure includes providing a substrate having a surface and forming a plurality of micro-channels in the surface. A first material composition is located in a first layer only in each micro-channel and not on the surface. A second material composition different from the first material composition is located in a second layer different from the first layer only in each micro-channel and not on the surface. The first material composition in the first layer and the second material composition in the second layer form an electrically conductive multi-layer micro-wire in each micro-channel.


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