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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9226400 B1

PDFFull Text
Date of Patent:
Dec. 29, 2015

Filed:

Jan. 04, 2013

Multilayer ceramic electronic device and method for manufacturing the same

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Masato Nomiya, Moriyama, JP;

Norio Sakai, Moriyama, JP;

Mitsuyoshi Nishide, Yasu, JP;

Assignee:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Attorney:

Keating & Bennett, LLP

Primary Examiner:

Sherman Ng

Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/00 (2006.01); H05K 1/16 (2006.01); H01R 4/58 (2006.01); H05K 7/10 (2006.01); H05K 1/18 (2006.01); H01L 21/48 (2006.01); H01L 23/13 (2006.01); H01L 23/15 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H05K 3/30 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H01L 21/4857 (2013.01); H01L 23/13 (2013.01); H01L 23/15 (2013.01); H01L 23/49822 (2013.01); H01L 24/16 (2013.01); H05K 3/305 (2013.01); H01L 2224/13099 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/73204 (2013.01); H01L 2924/01002 (2013.01); H01L 2924/01004 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0104 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01027 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01056 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/30107 (2013.01); H05K 1/0306 (2013.01); H05K 3/4626 (2013.01); H05K 3/4629 (2013.01); H05K 2201/0116 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10674 (2013.01); H05K 2201/10977 (2013.01); H05K 2203/1147 (2013.01); Y10T 29/4913 (2015.01); Y10T 29/49126 (2015.01); Y10T 29/49146 (2015.01);
Abstract

In a method for manufacturing a multilayer ceramic electronic device, a multilayer ceramic element assembly including laminated unsintered ceramic base material layers, a first conductor pattern, a seat portion disposed in a surface of the multilayer ceramic element assembly and arranged to mount a surface mount electronic device thereon, a second conductor pattern connected to the surface mount electronic device, and a resin introduction portion located outside a vertically projected region of the surface mount electronic device and arranged to introduce a resin to the seat portion is prepared. The multilayer ceramic element assembly is fired and the surface mount electronic device is mounted on the seat portion of the fired multilayer ceramic element assembly with the second conductor pattern therebetween. The resin is filled from the resin introduction portion into the seat portion and between the seat portion and the surface mount electronic device and is cured.

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