The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2015
Filed:
Jul. 08, 2013
Marvell International Ltd., Hamilton, BM;
Steven M. Goss, Corvallis, OR (US);
Roger N. Switzer, Vancouver, WA (US);
Yinfei Song, Shanghai, CN;
Marvell International Ltd., Hamilton, BM;
Abstract
In an embodiment, a printed circuit board includes a number of bond pads formed on a surface of the printed circuit board. At least a portion of the number of bond pads is arranged in an array of bond pads that includes a number of rows and a number of columns. A first portion of the number of rows include a number of adjacent rows having a first pitch and a second portion of the number of rows include at least one pair of adjacent rows having a second pitch different from the first pitch. In an embodiment, the second pitch is greater than 0.5 mm and less than 1.5 mm. In some embodiments, the array of bond pads can include at least one row of no-connect bond pads.