The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 29, 2015
Filed:
Nov. 21, 2012
Applicant:
Terukazu Ihara, Ibaraki, JP;
Inventor:
Terukazu Ihara, Ibaraki, JP;
Assignee:
NITTO DENKO CORPORATION, Ibaraki-shi, Osaka, JP;
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/48 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 1/05 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0298 (2013.01); H05K 1/056 (2013.01); H05K 3/0058 (2013.01); H05K 2201/0191 (2013.01); H05K 2201/2009 (2013.01); Y10T 29/49146 (2015.01);
Abstract
In a suspension board, a conductor layer having a predetermined pattern is formed on the upper surface of a first insulating layer. The first insulating layer has a thick portion having a large thickness and a thin portion having a small thickness. A reinforcing layer is formed on the upper surface of the first insulating layer so as to overlap with a boundary between the thick portion and the thin portion.