The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 29, 2015

Filed:

Jan. 25, 2011
Applicants:

Martin Bleicher, Fichtenau, DE;

Peter Goesele, Ellwangen-roehlingen, DE;

Roland Kraus, Harthausen-essingen, DE;

Rainer Lang, Dinkelsbuehl, DE;

Josef Sinder, Ellwangen, DE;

Frank Stredak, Feuchtwangen, DE;

Inventors:

Martin Bleicher, Fichtenau, DE;

Peter Goesele, Ellwangen-roehlingen, DE;

Roland Kraus, Harthausen-essingen, DE;

Rainer Lang, Dinkelsbuehl, DE;

Josef Sinder, Ellwangen, DE;

Frank Stredak, Feuchtwangen, DE;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 24/00 (2011.01); H01R 13/50 (2006.01); H01R 13/506 (2006.01); B29C 45/00 (2006.01); B29L 31/34 (2006.01); H01R 13/436 (2006.01); H01R 13/52 (2006.01);
U.S. Cl.
CPC ...
H01R 13/50 (2013.01); H01R 13/506 (2013.01); B29C 45/006 (2013.01); B29C 2045/0065 (2013.01); B29L 2031/34 (2013.01); H01R 13/4361 (2013.01); H01R 13/5219 (2013.01);
Abstract

A socket housing comprises an inner part and an outer part, the inner part being formed to receive at least one electrically conductive contact element, and a wall of the outer part defining a cavity. Therein, the inner part and the outer part are arranged adjoining one another. An external diameter of the inner part is equal to or less than an internal diameter of the outer part. The socket housing is formed in one piece, the inner part and the outer part being connected via a crosspiece formed as a predetermined breaking point.


Find Patent Forward Citations

Loading…