The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 29, 2015

Filed:

Jan. 23, 2013
Applicants:

The University of Tokyo, Bunkyo-ku, Tokyo, JP;

Hitachi, Ltd., Chiyoda-ku, Tokyo, JP;

Inventors:

Motomune Kodama, Tsuchiura, JP;

Kazuhide Tanaka, Hitachi, JP;

Junichi Shimoyama, Tokyo, JP;

Akiyasu Yamamoto, Tokyo, JP;

Assignees:

Hitachi, Ltd., Tokyo, JP;

The University of Tokyo, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 33/035 (2006.01); H01L 39/12 (2006.01); H01L 39/14 (2006.01); H01L 39/24 (2006.01); C01B 35/04 (2006.01);
U.S. Cl.
CPC ...
H01L 39/125 (2013.01); C01B 35/04 (2013.01); H01L 39/141 (2013.01); H01L 39/2487 (2013.01); Y10T 428/12181 (2015.01);
Abstract

An MgBsuperconducting wire excellent in critical current density property is supplied by using a crystalline boron powder which is low in costs and easy to obtain. For the wire, a precursor of the MgBsuperconducting wire is used, the precursor having a linear structure including a core region containing a magnesium powder and a boron powder, and a sheath region formed of a metal covering an outer circumferential portion of the core region. The boron powder is crystalline, and has a volume-mean particle size of 2 μm or less.


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